Sony plans to equip PlayStation 6 with an evaporative-based cooling system that will replace the liquid metal used in PlayStation 5.
Key features of the new design:
- 💧 use of a liquid (for example, water)
- several conical heat pipes
- heat circulation and prevention of console overheating
Cooling efficiency will not depend on the device’s position, so PlayStation 6 can be used:
- horizontally
- vertically
without any loss of performance.
In addition to improving thermal performance, moving away from liquid metal will help reduce overall manufacturing costs, which are rising due to the increasing cost of other components. According to preliminary estimates, PlayStation 6 will enter the market at a price of about 1000 US dollars.
Analysts also believe that Microsoft may use a similar technology in its next device, known as Project Helix.